Chiplets are small, modular integrated circuits that can be combined to create a more complex system-on-chip (SoC) or multi-die design. Unlike traditional monolithic chips, which incorporate all functionalities into a single silicon die, Chiplets break down these into smaller, specialized dies. These Chiplets are then interconnected within a single package, allowing for greater chip design flexibility, efficiency, and scalability.
The growth of the Chiplet market is driven by the adoption of high-performance computing (HPC) servers in various sectors, the proliferation of data centers worldwide, and the adoption of advanced packaging technologies.
The increased adoption of advanced packaging technologies is expected to fuel the growth of the Chiplet market during the forecast period.
The adoption of standards like UCIe will drive innovation, enabling broad collaboration across the semiconductor value chain.
Edge Computing and Mobile Computing are emerging application areas for chiplets, offering the potential for significant market growth in the years to come.
