The filing trend for Chiplet technology saw consistent growth from 2015 to 2023. This period marks the largest number of patent filings and indicates the boost in the development of Chiplet technology during this phase.
A total of 372 patents were filed in 2023, marking the highest number for any year since filings for Chiplet technology began.
Intel is the top patent filer with 169 patents. Intel pioneered technologies such as EMIB (Embedded Multi-Die Interconnect Bridge) and Foveros 3D stacking, which are foundational to chiplet integration.
The company is followed by IBM, which holds 167 patents. Microntech, Hitachi, Samsung, Fujitsu, Qualcomm, AMD, and Oracle are among the other prominent players in the top 20 assignees list. AMD is among the first movers in the commercial Chiplet Market. AMD’s Zen 2 architecture (Ryzen, EPYC) used Chiplets before Intel did.
