Description
Chiplets are small, modular integrated circuits that can be combined to create a more complex system-on-chip (SoC) or multi-die design. Unlike traditional monolithic chips, which incorporate all functionalities into a single silicon die, Chiplets break down these into smaller, specialized dies. These Chiplets are then interconnected within a single package, allowing for greater chip design flexibility, efficiency, and scalability.
These Chiplets communicate with each other through high-speed interconnects inside the same chip package. When assembled, they function as if they were one large chip.
The key application areas of Chiplet technology include Automotive, IoT, Display Devices, Telecommunications, Consumer Electronics, Healthcare, High-Computation, Wearable Devices
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